Inspur and Nutanix achieved strategic cooperation and launched first joint solution
A few days ago, Nutanix, the leader in enterprise cloud computing and Inspur, the world's leading computing solution provider has had a cooperation agreement, to provide users with a large multi-cloud architecture based on Inspur server and Nutanix enterprise cloud operating system. The first solution will be based on Inspur’s flagship NF5280M5 dual-channel server, characterized by its controllability and security of the private cloud, and simplicity, agility and lower TCO of the public cloud.
“This is a great day for Inspur customers in China” said Matt Young. SVP Asia Pacific and Japan, Nutanix. “Now they can enjoy the robustness and reliability of Inspur with the simplicity and flexibility of Nutanix. We are going to change the way for Chinese customers and operate in a multi-cloud world.”
Combining Inspur hardware with Nutanix's software can bring extraordinary application value and experience to traditional enterprise and government users. "as the world's leading provider of hyper-convergence architectures and solutions, Nutanix takes possession of a large number of products and solutions deployed by Fortune Global 500 companies and other major users. The cooperation further strengthens Chinese customer’s choice of Nutanix Chinese customers for the multi-cloud infrastructure server platform. As a leading IT company in China, Inspur joined the list of equipment suppliers of Nutanix software, which helps Nutanix to reach into other areas in the China market.
The cooperation also revealed Inspur’s development plan in the field of hyper-converged infrastructure. The fusion architecture is divided into two technologies: software definition and hardware reconstruction. Inspur convergence architecture technology strategy has always been based on hardware reconfiguration, from the three levels of cabinets, servers and chips to achieve hardware decoupling and pooling. At present, I/O and storage pooling schemes have been developed at the chip level and are widely applied in artificial intelligence, video, thermal and cold data integration management and other scenarios.